Due to the impact of the outbreak of coronavirus disease (COVID-19), the IEEE 6th International Conference on Applied System Innovation 2020  (IEEE ICASI 2020) conference scheduled to be held in Chiba, Japan, from May 13 – 17, 2020 will be postponed to Taitung, Taiwan from November 5 – 8, 2020. We apologize for any inconvenience caused. For the publication of academic research results, the ICASI Committee decided to extend the early bird registration until October 01, 2020, and the full-paper deadline to October 20, 2020. Full-paper registered before May 31 will be submitted to SCI journals from May 1. Up to 100 conference papers selected for publications in T&F Proceedings or IEEE Xplore will also be submitted to the publishers immediately. If your registration is finished between June 1 and October 20, your article will be submitted to SCI journals after the conference, and the articles selected for publication in the proceedings will be incorporated in the 9th ICICE conference proceedings.

IEEE ICASI 2020 provides a unified communication platform for researchers in the topics from advanced material science & engineering, information technology, communication science & engineering, applied mathematics, computer science, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering and other related fields. 

Professionals from industry, academia and government are encouraged to discourse on research and development, professional practice, business and management in the information, innovation, communication and engineering fields are welcome to participate in IEEE ICASI 2020. This conference enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally. During the conference, there will be substantial time for presentation and discussion. Attendants will find various activities useful in bringing together a diverse group of engineers and technologists across the disciplines for the generation of new ideas, collaboration potential and business opportunities.

All accepted papers will be submitted in the proceedings published by T&F. Furthermore, suitable conference content (in the scope of electrical and electronic engineering) will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. Excellent papers selected from IEEE ICASI 2020 will be recommended to be published on suitable 13 different SCI journals after an additional review process and may need extra publication charge:

(1) IEEE Sensors Letters (Papers submitted to this journal will be limited to a maximum length of 4 pages which includes a minimum of single column restricted for references.)
(2) Materials (SCI; ISSN 1996-1944; IF: 2.972)
(3) Energies (SCI; ISSN 1996-1073; IF: 2.707)
(4) Sensors (SCI; ISSN 1424-8220; IF: 3.031)
(5) Applied Sciences (SCI; ISSN 2076-3417; IF: 2.217)
(6) Micromachines (SCI; ISSN: 2072-666X; IF: 2.426)
(7) Coatings (SCI; ISSN: 2079-6412; IF: 2.330)
(8) Microsystem Technologies (SCI; ISSN: 1432-1858; IF: 1.513)
(9) Sustainability (SCI and SSCI; ISSN 2071-1050; IF: 2.592)
(10) Sensors and Materials (SCI; ISSN: 0914-4935; IF: 0.468)
(11) Journal of Internet Technology (JIT) (SCI; ISSN 1207-9264; IF: 0.715)
(12) Applied System Innovation (ISSN 2571-5577)
(13) Journal of Cultural and Creative Industries Research (ISSN: 2308-5193; Chinese version)

The official language is English. Submission of the abstract and full paper should be via the system of submission in website https://2020.icasi-conf.net/ by September 30 & October 20, 2020. Length of the full paper is limited within 6 pages (max). For formatting information and templates, please browse URL: https://2020.icasi-conf.net/. If there is any problem about submission, please contact Email: office.icasi@gmail.com

IEEE ICICE 2019 Call for Papers

 8^th IEEE International Conference on Innovation, Communication and Engineering 2019

(IEEE ICICE 2019)

October 25-30, 2019, Zhengzhou (鄭州) , Henan Province, China

URL: http://2019.icice.net

Email: office.icice@gmail.com

Organized by:

IEEE Tainan Section Sensors Council (IEEE TSSC)

Taiwanese Institute of Knowledge Innovation, TIKI

National Cheng Kung University

National Quemoy University

Fujian University of Technology

Kun Shan University

National Formosa University

National Kaohsiung University of Science and Technology

National United University

National University of Tainan

National Yunlin University of Science and Technology

Southern Taiwan University of Science and Technology

Yuan Ze University

The 8^th IEEE International Conference on Innovation, Communication and Engineering 2019 (IEEE ICICE 2019) are organized by IEEE Tainan Section Sensors Council (IEEE TSSC) and Taiwanese Institute of Knowledge Innovation (TIKI), and will be held in Zhengzhou, Henan Province, China on October 25~30, 2019. It will provide a unified communication platform for researchers with a wide range of topics, such as information technology, innovation design, communication science & engineering, industrial design, creative design, applied mathematics, computer science, design theory, cultural & creative research, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering, material science and other related fields. Professionals from industry, academia and government are encouraged to discourse on research and development. Professional practice, business and management in the information, innovation, communication and engineering fields are welcome to participate in IEEE ICICE 2019. This conference enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally. During the conference, there will be substantial time for presentation and discussion. Attendants will find various activities useful in bringing together a diverse group of engineers and technologists across the disciplines for the generation of new ideas, collaboration potential and business opportunities. Submitted manuscripts will be reviewed by three reviewers in 1 week.

Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases.

(1) Materials (SCI; ISSN 1996-1944; IF: 2.972; 10% discount of publication fee)
(2) Energies (SCI; ISSN 1996-1073; IF: 2.707; 10% discount of publication fee)
(3) Sensors (SCI; ISSN 1424-8220; IF: 3.031; 10% discount of publication fee)
(4) Applied Sciences (SCI; ISSN 2076-3417; IF: 2.217; 10% discount of publication fee)
(5) Micromachines (SCI; ISSN: 2072-666X; IF: 2.426)
(6) Coatings (SCI; ISSN: 2079-6412; IF: 2.330)
(7) Microsystem Technologies (SCI; ISSN: 1432-1858; IF: 1.513)
(8) Sustainability (SCI and SSCI; ISSN 2071-1050; IF: 2.592)
(9) Sensors and Materials (SCI; ISSN: 0914-4935; IF: 0.468)
(10) Journal of Internet Technology (JIT) (SCI; ISSN 1207-9264; IF: 0.715)
(11) Applied System Innovation (ISSN 2571-5577)
(12) Journal of Cultural and Creative Industries Research (ISSN: 2308-5193; Chinese version)
(13) Journal of Science and Innovation (ISSN: 2078-5453; English version, free charge